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Precision laser welding process of laser welding machine on mobile phone chip

Mobile phone chips usually refer to chips used in mobile phone communication functions, including baseband, processor, coprocessor, RF, touch screen controller chip, Memory, wireless IC and power management IC.

With the rapid development of global mobile communication technology, many mobile phone manufacturers are competing to launch new types of mobile phone with small size and powerful features. In these new mobile phones, the advanced BGA ICs are widely used. This increasingly popular technology can greatly reduce the size of mobile phones, enhance functions, reduce power consumption, and reduce production costs. Since the pad of the chip is very small, a precision welding machine with a very good welding effect is used to weld the chips and other parts in the phone.

The welding seam by traditional welding method is not beautiful, and it is easy to deform the periphery of the product, which is prone to desoldering. And the internal structure of the mobile phone is fine. When welding is used for connection, the welding spot area is required to be very small, the ordinary welding machine is difficult to meet this requirements, so the welding between the main components in the mobile phone is mostly laser welded.

The laser welding technology used to weld the mobile phone chip, the weld seam is exquisite, and there is no bad situation such as desoldering. Laser welding uses high energy density laser beam as a heat source to melt and solidify the surface of the material into a whole, which has the characteristics of high speed, large depth and small deformation.

The 70W nanosecond pulse Laser welding machine developed by Shenzhen Sunlaser mainly focuses on the welding of thin-walled materials and precision parts of heterogeneous metal materials, which can realize spot welding and stack welding. It can be welded at room temperature or under special conditions. The welding equipment is simple and can perform micro welding. The small spot can be obtained after laser beam focus, and can be accurately positioned for the mass welding of micro and small workpieces.

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